free hit counter
LG L1150 Service Manual
  1. Manuals
  2. Brands
  3. LG Manuals
  4. Cell Phone
  5. L1150
  6. Service manual
LG L1150 Service Manual

LG L1150 Service Manual

Hide thumbs Also See for L1150:
Table of Contents

Advertisement

Quick Links

Download this manual See also: User Manual
Service Manual
L1150
P/N : MMBD0034601
Date: June, 2004 / Issue 1.0

Advertisement

Table of Contents
loading

Related Manuals for LG L1150

Summary of Contents for LG L1150

  • Page 1 Service Manual L1150 P/N : MMBD0034601 Date: June, 2004 / Issue 1.0...
  • Page 2 LGE Inc. Furthermore, LGE Inc. reserves the right, without notice, to make changes to equipment design as advances in engineering and manufacturing methods warrant. * This manual provides the information necessary to install, program, operate and maintain the L1150.

  • Page 4: Table Of Contents

    Table of Contents 3.3. Analog Baseband(ABB) Processor..27 1. Introduction ........5 3.3.1. General Description ....27 1.1 Purpose........... 5 3.3.2. Audio Signal Processing & 1.2 Regulatory Information......5 Interface........28 1.2.1. Security........5 3.3.3. Audio uplink processing..... 28 1.2.2. Incidence of Harm......5 3.3.4.
  • Page 5 F. Calibration program ....... 126 4.6. Speaker/Receiver Trouble ....57 G. Calibration Equipment Setup ..127 A. Receiver Trouble ......59 H. Calibrate L1150 with ChiWoo..128 B. Speaker Trouble......60 I. Setup and Test with LAPUTA ..129 4.7. Microphone Trouble ......61 4.8.

  • Page 6: Introduction

    A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the L1150 or compatibility with the network, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

  • Page 7: Notice Of Radiated Emissions

    1. Introduction 1.2.5. Notice of Radiated Emissions The L1150 complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.
  • Page 8 Global System for Mobile Communications IPUI International Portable User Identity Intermediate Frequency Liquid Crystal Display Low Drop Output Light Emitting Diode LG Electronics OPLL Offset Phase Locked Loop Power Amplifier Module Printed Circuit Board Programmable Gain Amplifier Phase Locked Loop...

  • Page 9: General Performance

    2. General Performance 2. General Performance 2.1 H/W Feature A. Hardware Feature • GSM 850 / DCS 1800/ PCS 1900 Tri-Band • 65k Color-TFT(128x160) Main LCD, 4 Gray Mono (96x64) Sub LCD • 950mAh Li-Ion Battery • 3 V plug-in type SIM card socket •...
  • Page 10 2. General Performance Item Feature Comment Standard Battery Li-ion, 950mAh ..AVG TCVR Current 250mA Standby Current < 5.2mA Talk time At least 3.5 hours at PL5. (GSM 850) At least 4.5 hours at PL0. (1800/1900) Standby time up to 250 hours at DRX 6. Charging time 3 hours RX Sensitivity...

  • Page 11: Technical Specification

    2. General Performance 2.2 Technical Specification Item Description Specification GSM850 TX: 824.2 + 0.2*(n-128) (n=128 ~ 251) RX: TX + 45 MHz DCS1800 Frequency Band TX: 1710 + ( n-511 ) x 0.2 MHz (n = 512 ~ 885) RX: TX + 95 MHz PCS1900 TX: 1850 + ( n-511 ) x 0.2 MHz RX: 1930 + ( n-511 ) x 0.2 MHz (n = 512 ~ 810)
  • Page 12 2. General Performance Item Description Specification GS850 Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800 1,800 ~ 3,000 3,000 ~ 6,000 Output RF Spectrum 6,000 (due to modulation) DCS1800/PCS1900 Offset from Carrier (kHz). Max. dBc +0.5 600 ~ 1,200 1,200 ~ 1,800...
  • Page 13 2. General Performance Item Description Specification DCS1800/PCS1900 Offset from Carrier (kHz) Max. (dBm) Output RF Spectrum (due to switching transient) 1,200 1,800 Conduction, Emission Status Spurious Emissions Conduction, Emission Status GSM850 BER (Class II) < 2.439% @-102dBm Bit Error Ratio DCS1800/PCS1900 BER (Class II) <...
  • Page 14 2. General Performance Item Description Specification STMR 13 5 dB Stability Margin > 6 dB dB to ARL (dB) Level Ratio (dB) 17.5 22.5 30.7 Distortion 33.3 33.7 31.7 25.5 Side tone Distortion Three stage distortion < 10% <Change> System frequency (26 MHz) tolerance <Change>...
  • Page 15 2. General Performance Item Description Specification Battery Bar Number Voltage ( 0.03V) 3.89V~4.2V Battery Indicator 3.75V~3.89V 3.68V~3.75V 3.59V~3.68V ~3.59V 3.59V 0.03V (Call) Low Voltage Warning 3.50V 0.03V (Standby) Forced shut down Voltage 3.35 0.03 V 1 Li-ion Battery Battery Type Standard Voltage = 3.7 V Battery full charge voltage = 4.2 V Capacity: 950mAh...

  • Page 16: H/W Circuit Description

    3. H/W Circuit Description 3. H/W Circuit Description 3.1. RF Circuit The RF parts consist of a transmitter part, a receiver part, a frequency synthesizer part, a voltage supply part, and a VC-TCXO part. The AeroI transceiver is composed of one RF chipset, Si4205[U803] which is a triple and quad-band GSM/GPRS wireless communications.

  • Page 17: Receiver Part

    3. H/W Circuit Description 3.1.2. Receiver Part The Aero I transceiver uses a low-IF receiver architecture which allows for the on-chip integration of the channel selection filters, eliminating the external RF image reject filters and the IF SAW filter required in conventional superheterodyne architectures. Compared to a direct-conversion architecture, the low-IF architecture has a much greater degree of immunity to dc offsets, which can arise from RF local oscillator (RFLO) self-mixing, nd-order distortion of blockers, and device 1/f noise.
  • Page 18 3. H/W Circuit Description Figure 1. Receiver Part Block Diagram - 17 -...

  • Page 19: Synthesizer Part

    3. H/W Circuit Description 3.1.3. Synthesizer Part The Aero I transceiver integrates two complete PLLs including VCOs, varactors, resonators, loop filters, reference and VCO dividers, and phase detectors. The RF PLL uses two multiplexed VCOs. The RF1 VCO is used for receive mode, and the RF2 VCO is used for transmit mode. The IF PLL is used only during transmit mode.

  • Page 20: Transmitter Part

    3. H/W Circuit Description 3.1.4. Transmitter Part The transmit (TX) section consists of an I/Q baseband upconverter, an offset phase-locked loop (OPLL) and two output buffers that can drive external power amplifiers (PA), one for the GSM 850 (824 to 849 MHz) band and one for the DCS 1800 (1710 to 1785 MHz) and PCS 1900 (1850 to 1910 MHz) bands.

  • Page 21: Power Amplifier

    3. H/W Circuit Description 3.1.5. Power Amplifier The Sky77325 [U804] is a quad-band GSM850/GSM900/DCS/PCS power amplifier module that incorporates an indirect closed loop method of power control. The indirect closed loop is fully self- contained and it does not require loop optimization. It can be driven directly from the DAC output in the baseband circuit.

  • Page 22: Power Supplies And Control Signals

    3. H/W Circuit Description 3.1.7. Power Supplies and Control Signals An external regulator (U805) is used to provide DC power to RF part. Every RF component except power amp module uses this external regulator. Figure 6. External regulator Circuit RF2.85V VBAT U805 ADP3330...

  • Page 23: Digital Baseband(Dbb) Processor

    3. H/W Circuit Description 3.2. Digital Baseband(DBB) Processor O Circuito Receptor, localizado no CX74017, contém todos os circuitos completamente ativados, corrente total do receptor com exceção dos filtros RF SAW discretos da extremidade frontal. O sinal filtrado e amplificado é convertido em um mixer RF para saída banda base. O caminho de recepção é fornecido por um filtro interno de canal.

  • Page 24: Block Description

    3. H/W Circuit Description 3.2.2. Block Description CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA bus standard as interface with their associated application peripherals. CALYPSO is composed from the following blocks: • ARM7TDMIE : ARM7TDMI CPU core •...

  • Page 25: External Devices Connected To Memory Interface

    3. H/W Circuit Description 3.2.3. External Devices connected to memory interface Table 3-2. Memory interface Device Name Maker Write Read Access Time Access Time FLASH AM50DL128CH 70ns 70ns SRAM AM50DL128CG70I 70ns 70ns NM186TB-2 NEODIS 130ns 50ns Melody IC YMU762 Yamaha 50ns 80ns 3.2.4.

  • Page 26: Uart Interface

    ] SIM_CD --------------- SIM card presence detection Figure 10. SIM Interface 3.2.6. UART Interface L1150 have two UART Drivers as follow : - UART1 : Hardware Flow Control / Fax&Data Modem - UART2 : Handsfree Control / SW trace or IrDA Modem Table 3-4.

  • Page 27: Gpio Map

    3. H/W Circuit Description 3.2.7. GPIO map In total 16 allowable resources, L1150 is using 13 resources except 3 resources dedicated to SIM and Memory. L1150 GPIO(General Purpose Input/Output) Map, describing application, I/O state, and enable level, is shown in below table.

  • Page 28: Analog Baseband(Abb) Processor

    3. H/W Circuit Description 3.3. Analog Baseband(ABB) Processor 3.3.1. General Description IOTA is Analog Baseband (ABB) Chip supports GSM900, DCS1800, PCS1900, GPRS Class 10 with Digital Baseband Chip(Calypso G2). IOTA processes GSM modulation/demodulation and power management operations. Block Description - Audio Signal Processing & Interface - Baseband in-phase(I), quadrature(Q) Signal Processing - RF interface with DBB (time serial port) - Supply voltage regulation...

  • Page 29: Audio Signal Processing & Interface

    3. H/W Circuit Description 3.3.2. Audio Signal Processing & Interface Audio signal processing is divided Uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format and delivered to RF Chip.

  • Page 30: Audio Downlink Processing

    3. H/W Circuit Description Figure 13. Uplink Path 3.3.4. Audio downlink processing The downlink signal is passed from EARP and EARN pins of IOTA. When the headset is inserted and Calypso detects ‘Jack pluged state’ from HOOK_DETECT terminal, Calypso makes IOTA switches the downlink path from ‘EARP’...

  • Page 31: Baseband Codec (Bbc)

    3. H/W Circuit Description 3.3.5. Baseband Codec (BBC) Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL). BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) component and quadrature(Q) component with burst data from DBB. This modulated signal is transmitted through RF section via air.

  • Page 32: Voltage Regulation (Vreg)

    There are 7 LDO(Low Drop Output) regulators in ABB chip. The output of these 7 LDOs are as following table. (Figure13) shows the power supply related blocks of DBB/ABB and their interfaces in L1150. Figure 16. Power Supply Scheme - 31 -...

  • Page 33: Adc Channels

    3. H/W Circuit Description Table 3-6. LDO Output Table Output Voltage Usage VRDBB 1.5V Digital Core of DBB VRIO 2.8V Peripheral devices VRMEM 2.8V External memory VRRAM 2.8V LCD & peripheral devices VRABB 2.8V Analog Block of ABB VRSIM 2.8V SIM card driver VRRTC 1.5V...

  • Page 34: Charging

    3. H/W Circuit Description 3.3.8. Charging Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC channel. Battery Block Indication and SPEC of L1150 is as follow. Figure 17. Battery Block Indication 4.2V ~ 3.89V 3.89V ~ 3.75V 3.75V ~ 3.68V...

  • Page 35: Memory

    ] IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin. ] CHARGER_IC :When a charger voltage is above VBAT+0.4V on VCHG. 3.3.10. Memory L1150 using 128Mbit Flash + 64Mbit pSRAM with 16 bit parallel data bus thru ADD01 ~ ADD22. 3.3.11. Display & FPC Interface LCD module include:...
  • Page 36 3. H/W Circuit Description Pin No. Pin Name(WS) Description L_A(1) Select the Register.(H:control, L:Index/Status) IFMODE Mode Select.(H:262K color, L:65K color) VBACKUP Backup Battery V_SRAM Power Supply (for Driver) Ground C_PWR Power Supply (for Camera) C_MCLK Master input clock (camera) C_PCLK Pixel output clock (camera) C_HS horizontal synchronization clock (camera)

  • Page 37: Keypad Switching & Scanning

    3. H/W Circuit Description Pin No. Pin Name(WS) Description MLED1 Main LCD B/L 1 Ground L_D(15) Bi-Direction Data Bus for LCD L_D(14) Bi-Direction Data Bus for LCD L_D(13) Bi-Direction Data Bus for LCD L_D(12) Bi-Direction Data Bus for LCD L_D(11) Bi-Direction Data Bus for LCD L_D(10) Bi-Direction Data Bus for LCD...

  • Page 38: Keypad Back-Light Illumination

    3. H/W Circuit Description 3.3.13. Keypad back-light Illumination There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. Keypad Back-light is driven by ‘LEDB’ line from IOTA . Figure 19. Keypad Back-light Scheme KEY BACKLIGHT VBAT R422 LEDB R423 VA402 AVL5M02-200...

  • Page 39: Camera Circuit

    3. H/W Circuit Description 3.4. Camera Circuit General description of CLC344ED Camera chipset. - External Clock Source Up to 27 MHz - Internal Clock Divider 1/2, 1/3, 1/4 for Sensor Clock Output - Support Standard SRAM Interface (6bit Address & 16bit Data) for CPU Interface - 4Mbit Stacked SRAM - Support LCD Signal By-pass Mode - Fully Hardwired JPEG and Motion-JPEG Codec...
  • Page 40 3. H/W Circuit Description Table 3-10. CLC344ED Interface Port Name Description Write control to CLC344ED or LCD module Read control. The phone do not read data from LCD chip CAM_HOLD This signal determines the camera operation mode. Making high, disable all CLC344ED functions and signals bypass to LCD module directly.
  • Page 41 3. H/W Circuit Description Figure 22. CLC344ED, Camera Chip Circuit 2V85_CAM 2V85_CAM C_CD7 C_CD6 C_CD5 C_CD4 C_CD3 C_CD2 C_CD1 C_CD0 C_SCK C_SDA C_PCLK C_PWON C_RST C_HS C_VS C_MCLK 2V85_CAM C601 C602 L_DA17 VDDI1 0.1u 0.01u L_DA16 VDDI2 VDDI3 VDDI4 J2 LS_CS VDDC1 D5 L_SUB_CS K2 L_DA0...

  • Page 42: Baseband Components

    3. H/W Circuit Description A. BaseBand Components (Component Side) - 41 -...

  • Page 43: Baseband Components

    3. H/W Circuit Description B. BaseBand Components (Keypad Side) C. Digital Baseband(DBB) Processor - 42 -...

  • Page 44: Analog Main Processor (Abb)

    3. H/W Circuit Description D. Analog Main Processor (ABB) • Applications include GSM 850, 900, DCS 1800, PCS 1900 Cellular Telephones • Voice Coder/Decoder (CODEC) • Baseband CODEC single and multislot with I/Q RF Interface • Auxiliary RF Converters • SIM Card Interface •...

  • Page 45: Memory

    3. H/W Circuit Description E. Memory MCP BLOCK DIAGRAM • Memory used L1150 is designed by AMD • Mixed Multi-Chip Package containing a 64M pSRAM and 128M Flash Memory • MCP(Multi-Chip Package) Features • Power Supply Voltage of 2.7 to 3.3 V •...

  • Page 46: Voltage Regulation (Ldo)

    3. H/W Circuit Description F. Voltage Regulation (LDO) • VRDBB • Provides the power to the DBB(Calypso) Core • 1.5V / 120mA max. • VRRAM • Provides the power to the Analog S/W, IC, etc. external memory • 2.8V / 50mA •...

  • Page 47: Midi

    3. H/W Circuit Description G. MIDI • The ringing source of L1150 is the MIDI. • The MIDI chip which is used in L1150 is YMU762 YAMAHA. • YMU762 generates 40-poly MIDI sound. H. Charging • Charging method : CC-CV •...

  • Page 48: Key Back-Light Illumination

    3. H/W Circuit Description I. KEY Back-light Illumination • KEYPAD Back-light Scheme. • There are 12 Deep Blue LEDs in Main Board for Keypad Backlight. • Keypad Back-light is driven by ‘LEDB’ line from IOTA . KEY Backlight VBAT R422 LEDB R423 VA402...

  • Page 49: Keypad

    3. H/W Circuit Description K. Keypad • KEYPAD Back-light Scheme. The keyboard is connected to the chip using: - KBR (4:0) input pins for row lines - KBC (4:0) output pins for column lines Keypad Scanning Scheme L. Infrared • Infrared Interface. Allows you to send or receive data(Phonebook..) through the infrared port.

  • Page 50: Camera

    3. H/W Circuit Description M. CAMERA • CAMERA Interface. Allows you to use the built-in camera to take photos with the phone. - The phone encodes up to 640 x 480 size with free size support Built-in Camera BLOCK DIAGRAM N.

  • Page 51: Trouble Shooting

    4. TROUBLE SHOOTING 4. TROUBLE SHOOTING BaseBand Part Troubleshooting 4.1. Baseband Components (Component Side) - 50 -...

  • Page 52: Baseband Components (Keypad Side)

    4. TROUBLE SHOOTING U101 Analog Baseband Chipset (IOTA) U102 Digital Baseband Chipset (Calypso) X101 Crystal (32.768 KHz Oscillator) U201 Melody IC (40 Poly) U602 LDO (2.85V) U203 Analog Switch U301 OR Gate (Dual) U302 Memory (128M Flash + 64M SRAM) U501 IrDA Transceiver Module U502...

  • Page 53: Power On Trouble

    4. TROUBLE SHOOTING 4.3. Power On Trouble • Power On Sequence – Connecting Battery – Power-On Key Detection – END_ON_OFF signal goes to ABB and then ABB reset DBB by ON_OFF signal – ON_OFF turn low(0V) to HIGH(1.5V) and it resets Calypso. –...

  • Page 54: Charging Trouble

    4. TROUBLE SHOOTING 4.4. Charging Trouble • Charging method : CC-CV • Charger detect voltage : 4.0V • Charging time : 3h • Icon stop current : 80mA • Charging current : 450mA • CV voltage : 4.2V • Cutoff current : 60mA •...
  • Page 55 4. TROUBLE SHOOTING • Charging Procedure – Connecting TA & Charger Detection – Control the charging Current by ABB – Charging Current flows into the Battery. • Check Points – Connection of TA – Charging Current Path – Battery • Trouble Shooting Setup –...

  • Page 56: Lcd Display Trouble

    4. TROUBLE SHOOTING 4.5. LCD Display Trouble If the FPCB has a problem, the control signals for LCD cannot be transmitted properly. Check soldering and connection around connector • LCD Control Signals From Main Board – LCD_MAIN_CS, LCD_SUB_CS, _WR, LCD_RESET, A(1), CAM_HOLD, D(0)~(15), A(1) ~A(6) •...

  • Page 57: Block Diagram

    4. TROUBLE SHOOTING Block Diagram C_CD0 ~ C_CD7 C_SCK, C_SDA C_PCLK, C_RST Sensor C_HS, C_VS,C_ MCLK Path D(0) ~ D(15) L_D(0) ~ L_D(15) CN701 Camera L_SUB_CS FPCB FPCB A(1) ~ A(6) Calypso FPCB L_WR A(1) CLC344E (U102) FPCB 40pin 20pin LCD_RESET L_A(1) 60pin...

  • Page 58: Speaker/Receiver Trouble

    4. TROUBLE SHOOTING 4.6. Speaker/Receiver Trouble Block Diagram V_SRAM SPKN SPK_EN Calypso Speaker U102 FPCB FPCB C247 CN701 /Receiver MAX4624 RCV_N EAR_N SPKP U203 C206 R208 RCV_P EAR_P IOTA R250 U101 SPKN SPKP C208 YMU762 C212 C213 LCD Module Blue: SPKN U201 Red: SPKP Connector...
  • Page 59 4. TROUBLE SHOOTING Check soldering these points ! • Receiver Trouble shooting setup – Initialize GSM MS test equipment. – Connect PIF-UNION and power on. – Make a test call. – Set audio part at test equipment as PRBS or continuous wave, not echo. –...

  • Page 60: Receiver Trouble

    4. TROUBLE SHOOTING A. Receiver Trouble cf) PRBS : Pseudo Random Bit Sequence START Set audio part at test equipment as PRBS or continuous wave, not echo. Set the audio volume max. BB is out of order. Does sine wave appear Change the board.

  • Page 61: Speaker Trouble

    4. TROUBLE SHOOTING B. Speaker Trouble START Enter into Engineering Mode and go to menu "Baseband => Alert => Ring" Resolder the U205 Does sine wave appear SPK_EN signal is high? otherwise Change it. at C245? Connection between Melody IC is out of order. Reconnect FPCB.

  • Page 62: Microphone Trouble

    4. TROUBLE SHOOTING 4.7. Microphone Trouble Block Diagram MICBIAS R214 R217 IOTA MICP R219 C220 U101 C221 C222 MICN R222 C224 • Microphone Signal Flow • Check Points – MIC is enable by MICBIAS – Microphone bias – MICBIAS, MICP, MICN signals from ABB –...
  • Page 63 4. TROUBLE SHOOTING AC voltages of the signals MICP MICN The waveforms at MICP and MICN START Test : Baseband Audio Gain Loopback Test ON Conne ct the handset to network equipment and setup call. The voltage of R214 Resolder the R214. The soldering of R214 is OK? is 2.0V? Check the signal level at pin 1,2 of the MIC...

  • Page 64: Vibrator Trouble

    4. TROUBLE SHOOTING 4.8. Vibrator Trouble Block Diagram VIBRATOR YMU762 VBAT VBAT U201 L401 100nH D401 VBAT CN401 C401 C402 1SS302 0.1u L402 100nH VIBRATOR R404 MOTOR R405 Q402 VIBRATOR 2SC5585 1.5K KTC4072E R406 100K • Vibrator Operation Vibrator – Vibrator is controlled by MIDI chip •...
  • Page 65 4. TROUBLE SHOOTING START Enter into Engineering Mode and select Vibrator Connection of Reconnect vibrator blue and red is OK? CN401 Resolder the CN401 soldered well? Resolder the R404 Signal path is OK? R405, R406, D401 L402. Replace the U201. VIBRATOR signal is High? MIDI IC is broken.

  • Page 66: Keypad Backlight Trouble

    4. TROUBLE SHOOTING 4.9. Keypad Backlight Trouble Block Diagram VBAT LEDB IOTA R422 LEDB U101 R423 VA402 AVL5M02-200 • Backlight Operation – The keypad LED backlight is controlled with LEDB signal. – LEDB signal from ABB. – The LEDs are forward biased and turned on. •...
  • Page 67 4. TROUBLE SHOOTING All LEDs are not working START Enter into Engineering Mode and select Keypad On ABB is out of order. The Voltage of LEDB signal Change the Board. is about 0V? Power off and Measure the Resistor Value of all LEDs. Is there anything that Replace the LED.

  • Page 68: Folder On/Off Trouble

    4. TROUBLE SHOOTING 4.10. Folder ON/OFF Trouble Block Diagram V_IO FOLDER R424 R428 Calypso U102 R427 C403 C404 FOLDER A3212ELH _ defect U401 Keypad Side Component Side Folder signal V_IO Power • Folder Signal Status - L : Close (Magnetized) - H : Open (Not magnetized) •...
  • Page 69 4. TROUBLE SHOOTING START Reso lder the The all paths connected C403, C404, R424. to U401 are OK? Refer to The V_IO is 2.8V? Power On Trouble. The FOLDER signal is low Replace the U401. on magnetizing into U401? U401 is broken. The DBB(Calypso) is broken.

  • Page 70: Sim Detect Trouble

    4. TROUBLE SHOOTING 4.11. SIM Detect Trouble Block Diagram V_SIM VRSIM R501 SIM_IO IOTA C530 U101 Connector SIM_RST J501 SIM_CLK C506 PIN 5 PIN 7 PIN 3 PIN 1 • Connection between SIM and ABB – SIM_CLK, SIM_IO, SIM_RST • Check Point –...
  • Page 71 4. TROUBLE SHOOTING START ert the SIM Card Resolder the The soldering of SIM connector J501. is OK? Resolder the The all paths connected R501, C530, C506. to J501 are OK? SIM card is broken. The SIM Card is OK? Change the SIM Card.

  • Page 72: Camera Trouble

    4. TROUBLE SHOOTING 4.12. CAMERA Trouble Block Diagram C_CD0 ~ C_CD7 C_SCK,C_ SDA C_PCLK, C_RST Sensor C_HS, C_VS, C_MCLK Path Main D(0) ~ D(15) L_D(0) ~ L_D(15) CN701 Camera L_SUB_CS A(1) ~ A(6) Calypso L_WR A(1) FPCB CLC344E U102 LCD_RESET 60pin L_A(1) (U601)
  • Page 73 4. TROUBLE SHOOTING • Camera Sensor Block Diagram VBAT 2V85_CAM 2V85_CAM 2V85_CAM C_CD7 C_CD6 C_CD5 C_CD4 C_CD3 C605 C_CD2 ADP3330 U602 470p C_CD1 BCLKX C_CD0 _ERR C_SCK C_SDA C_PCLK C606 C_PWON C_RST C607 C_HS 1608 C_VS C_MCLK 2V85_CAM C601 C602 L_DA17 VDDI1 0.1u...
  • Page 74 4. TROUBLE SHOOTING Camera Chip LDO(2.85V) U601 U602 Camera Sensor Connector CN2 • Trouble Shooting Setup – Enter the engineering mode. – Go to menu “Baseband Camera ” • Trouble Shooting Procedure – Check the Power Supply(2.85). – Check the connection between connector and camera. •...
  • Page 75 4. TROUBLE SHOOTING START Does the LCD itself has Go to the LCD trouble no trouble? Change the Camera module. Check the voltage of Check the voltage of Change the main board Does it work properly? PIN1 of Q601 is 0V PIN3 of Q601 is 2.85V It's Camera module's problem.

  • Page 76: Earphone Trouble

    4. TROUBLE SHOOTING 4.13. Earphone Trouble Block Diagram V_IO R211 HSMICBIAS R210 R212 R213 IOTA HOOK_DETECT R220 U101 HSMICP C223 R232 ADIN1 C219 R216 • Ear-Jack Spec Inside • Earphone Detecting Operation – The ABB operates A/D conversion continuously and if the voltage of “ADIN1” node goes to 0V and the voltage at “HOOK_DETECT”...
  • Page 77 4. TROUBLE SHOOTING From U101(IOTA) V_IO R210 HSMICBIAS R211 Close to Ear-jack C214 2.2u C216 (1608) R212 (2012) 5.6K R213 To U101(IOTA) R241 The direction of the audio Signal to ear-mic Close to Ear-jack HOOK_DETECT J201 R220 100 C219 10u (2012) R216 R215 4.7...
  • Page 78 4. TROUBLE SHOOTING START cf) PRBS : Pseudo Random Bit Sequence ert the earphone into the headset. Go to page 73 Does the Audio profile change 1. Earphone detection problem to the earphone mode? Set the audio part of test equipment to PRBS or continuous wave mode Can you hear the sound from the earphone?
  • Page 79 4. TROUBLE SHOOTING 1. Earphone Detection problem Resolder the The soldering of R223, R225 R223, R225. is OK? The Voltage at "ADIN1" is 0V? The soldering of J201 Resolder the J201. is OK? The ABB is out of order. Change the board. The voltage at R220 The soldering of R220 Resolder the R220.

  • Page 80: Infrared Data Association Trouble

    4. TROUBLE SHOOTING 4.14. Infrared Data Association Trouble Block Diagram V_IO VBAT R502 Calypso IrDA TX_IRDA U102 C507 RX_IRDA Transceiver SD_IRDA U501 • Infrared Signal Flow – Infrared is enable by SD – TX_IRDA,RX_IRDA,SD_IRDA signals from DBB • Check Points –...
  • Page 81 4. TROUBLE SHOOTING START Set c onfiguration like Fig 1. Execute PCSync program(ContentsBank.exe) Resolder the The power is supplied to U501? R501, C503. The soldering of U501 is OK? Resolder the U501. The signal "TX_IrDA, RX_IrDA" Change the U501. are measured? The DBB is broken.

  • Page 82: The Block Diagram Of The Rf Part

    4. TROUBLE SHOOTING RF Part Technical Brief 4.15. The Block Diagram of the RF Part RF S PCS1900 DCS1800 GSM850 26MHZ 0/90 100kHz Antenna Switch CLK/DATA/EN GSM850 DCS1800 /PCS1900 TCXO 26MHZ - 81 -...
  • Page 83 4. TROUBLE SHOOTING SW801 U801 FL801 U804 U803 X801 U805 • U801 (NC7NZ34K8X) : Triple Buffer • U803 (SI 4205-BM) : RF transceiver chipset • U804 (SKY77325) : PAM (Power Amp Module) • U805 (ADP3330) : LDO • X801 (ERF3005A) : VCTCXO •...

  • Page 84: Tx / Rx Part Description

    4. TROUBLE SHOOTING 4.16. Tx / Rx Part Description • Regulator ( LDO ) • Produce 2.85V DC Power • Support DC Power to – RF Transceiver Chip(U803) – VCTCXO(X801) – Triple Buffer(U801) RF_EN RF main chip 2.85V DC Output VBAT_in •...
  • Page 85 4. TROUBLE SHOOTING • RF Transceiver Chip (Si4205) • PDNB, S_EN, S_CLK, S_DATA – From DBB Main Chip Set – Contains information all about ARFCN, voice data, user information etc. – RF Chips operate according to these signals S_DATA S_CLK SI4205 S_EN PDNB...

  • Page 86: Receiver Part Description

    4. TROUBLE SHOOTING 4.17. Receiver Part Description Rx Frequency Functional Block Diagram GSM850 : 869 ~ 894 MHz GSM1800 : 1805 ~ 1880 MHz GSM1900 : 1930 ~ 1990 MHz Xout 0/90 < SI4205_BM > 100kHz RF PLL VC_TCXO GSM850 : 1737.8 ~ 1787.8 MHz 26MHz GSM1800 : 1804.9 ~ 1879.9 MHz GSM1900 : 1929.9 ~ 1989.9 MHz...
  • Page 87 4. TROUBLE SHOOTING • Triple buffer controls the Ant SW with – VC_GSM_RX_TX(VC1), – VC_GSM850_TX(VC2) and – VC_GSM1800_1900_TX(VC3) Triple VC_GSM Buffer VC_GSM850 VC_GSM1800/1900 Control Signal Logic VC_GSM VC_GSM850 VC_GSM1800/1900 GSM RX DCS RX PCS RX GSM TX DCS/PCS TX - 86 -...
  • Page 88 4. TROUBLE SHOOTING Triple Buffer (NC7NZ34K8X) • From DBB, three control signals (VC1, VC2, VC3) are fed into the Triple Buffer • Triple buffer controls the Ant SW Triple Buffer VCC = 2.85 V, from LDO(U805) RF Transceiver Chip (SI4205_BM) 1) LNA input port of RF Main Chip(Si4205) •...
  • Page 89 4. TROUBLE SHOOTING 2) RX Local signal IF Frequency [MHz] RF1 Frequency [MHz] Rx Frequency [MHz] GSM850 869~894 1737.8~1787.8 GSM1800 1805~1880 1804.9~1879.9 GSM1900 1930~1990 1929.9~1989.9 • IF Frequency GSM_Rx_Frequency-GSM_RF1_Frequency/2 = 0.1 DCS/PCS_Rx_Frequency-DCS/PCS_RF1_Frequency = 0.1 • Near 0 IF (100kHz) system 3) Rx I/Q signal RX I/Q signals (RXQN, RXIP, RXIN, RXQP) are fed into the ABB RXQP...

  • Page 90: Transmitter Part Description

    4. TROUBLE SHOOTING 4.18. Transmitter Part Description Tx Block Diagram Tx Frequency GSM850 : 824 ~849MHz DCS : 1710 ~ 1785MHz PCS : 1850 ~ 1910MHz GSM850 Divider / 1,2 TxVCO DCS / PCS Divider RF2 Frequency GSM850 : 1272 ~ 1297MHz DCS : 1327 ~ 1402MHz Xout PCS : 1423 ~ 1483MHz...
  • Page 91 4. TROUBLE SHOOTING • Tx Local and IF signal (RF2 and IF) IF Frequency [MHz] IF/2 Frequency [MHz] RF2 Frequency [MHz] Tx Frequency [MHz] GSM850 824 ~ 849 1272 ~ 1297 GSM1800 1710 ~ 1785 1327 ~ 1402 GSM1900 1850 ~1910 1423 ~ 1483 –...
  • Page 92 4. TROUBLE SHOOTING • PAM – control signals – PA_ON • From DBB Chip Set • Enables Tx Path – PA_Band • From DBB Chip Set • Select PAM operating band • For Low : GSM selected • For High : PCS selected –...

  • Page 93: Rx Part Trouble Shooting

    4. TROUBLE SHOOTING 4.19. RX Part Trouble Shooting START Setup Test with LAPUTA Ch. 190 OR 661 OR 700 -60 dBm BCCH AGC Gain 24dB 1. Check Ant. SW and Triple Buffer 2. Check Ant. SW and RF SW connector 3.
  • Page 94 4. TROUBLE SHOOTING 1. Check Ant. SW(FL801) and Triple Buffer(U801) U801 FL801 – Check input signals(VC1, VC2, VC3) of the Triple buffer. – Check Ant. SW control signals (Outputs of the Triple buffer ). VC_GSM VC_GSM850 VC_GSM1800/1900 GSM_RX DCS_RX PCS_RX GSM_TX DCS/PCS_TX –...
  • Page 95 4. TROUBLE SHOOTING 2. Check Ant. SW(FL801) and RF SW connector(SW801) Check these circuit with High Frequency Probe. ANT SW You can see RF signal at Spectrum Analyzer ! 1) Check RF frequency at each point(1,2,3,4,5). Can you observe good RF signal at proper frequency? –...
  • Page 96 4. TROUBLE SHOOTING 3. Check VC_TCXO (ERF3005A) Check 26MHz Clock output. 26 MHz clock output to RF Chip set 4. Check LDO (ADP3330) Check LDO output voltage 2.85V RF_EN 2.85V DC Output VBAT_in - 95 -...
  • Page 97 4. TROUBLE SHOOTING 5. Check control signals _ PDNB, S_EN, S_CLK, S_DATA PDNB S_DATA S_CLK S_EN S_EN S_CLK PDNB S_DATA 6. Check RX I/Q signal Expended ! RXQP RXQN RXIP RXIN - 96 -...

  • Page 98: Tx Part Trouble Shooting

    4. TROUBLE SHOOTING 4.20. TX Part Trouble Shooting START Setup Test with LAPUTA GSM 190Ch. DAC 580 DCS 700Ch. DAC 600 PCS 661Ch. DAC 680 1. Check VCTCXO and Regulator 2. Check control signals 3. Check Tx I/Q 4. Check IF and Local signals 5.
  • Page 99 4. TROUBLE SHOOTING 1. Check VCTCXO and Regulator 1 VCTCXO • 26MHz Clock Output 2 Regulator • 2.85V Regulator Out 2. Check Control Signals 1 PDNB, S_EN, S_CLK, S_DATA Same as RX Trouble Shooting Procedure No.4 and 5. 3. Check Tx I/Q 1 Tx I/Q TxQN TxIN TxIP TxQP...
  • Page 100 4. TROUBLE SHOOTING 4. Check PAM Circuit 1 PAM input and output Check these points with High output DCP/PCS input input Frequency Probe. You can see RF signal at DCP/PCS Vbat Spectrum Analyzer! output • Tx Carrier Frequency – GSM 190Ch. : 836.6MHz –...
  • Page 101 4. TROUBLE SHOOTING 2 PAM control signals 5. Check Ant. SW circuit 1 Control signal VC1, VC2, VC3 Same as RX Trouble Shooting Procedure No.1 • Tx output Power – GSM : about 33dBm – DCS : about 30dBm – PCS : about 30dBm Check these points with High Frequency Probe.

  • Page 102: Disassembly Instruction

    5. DISASSEMBLY INSTRUCTION 5. DISASSEMBLY INSTRUCTION - 101 -...
  • Page 103 5. DISASSEMBLY INSTRUCTION - 102 -...
  • Page 104 5. DISASSEMBLY INSTRUCTION - 103 -...
  • Page 105 5. DISASSEMBLY INSTRUCTION - 104 -...
  • Page 106 5. DISASSEMBLY INSTRUCTION - 105 -...

  • Page 107: Download And Calibration

    – The older version software of the phone can be replaced to the newer version. B. The Environment of Downloading Software 1. In case of using the Data Kit • Preparation – Target Handset (L1150) – Data kit – Battery – IBM compatible PC supporting RS-232 with Windows 98 or newer •...
  • Page 108 6. DOWNLOAD AND CALIBRATION 2. In case of using the PIF • Preparation – Target Handset (L1150) – PIF – RS-232 Cable and PIF-to-Phone interface Cable – TA/Power Supply or Battery – IBM compatible PC supporting RS-232 with Windows 98 or newer •...
  • Page 109 6. DOWNLOAD AND CALIBRATION C. The Procedure of Downloading Software 1. Execute FLUID.EXE. And then a window will be shown as below. 2. Press “Add” button and select a software to download in browser. - 108 -...
  • Page 110 6. DOWNLOAD AND CALIBRATION 3. And then the window will be shown as below. Check the “Erase entire flash device” item. 4. Press “Global Settings” menu. Choose a correct serial port and set the configuration as below. - 109 -...
  • Page 111 6. DOWNLOAD AND CALIBRATION 5. Press “Erase/Program flash” menu. Click the “Erase/Program” item and you will see the window as below. 6. After you watched the “Bootloader: ” message, press the Power key of handset (in case of Data kit) or turn the POWER on (PIF) and switch on the TI-REMOTE (PIF).
  • Page 112 6. DOWNLOAD AND CALIBRATION 7. If downloading is completed, you will see the window as below. And then turn the Power On after removing and inserting battery again. (in using of battery) - 111 -...

  • Page 113: Block Diagram

    7. BLOCK DIAGRAM 7. BLOCK DIAGRAM Baseband Part The Block Diagram of the Baseband Part - 112 -...

  • Page 114: Circuit Diagram

    YH HEO 2004 KBR(0:4) TDO_1 TDO_ARM RPWON RPWON RPWON VBAT VBAT VBAT 03/18 Checked DS JUNG _BSCAN 2004 _BSCAN JTAGEN DRAWING BB_MAIN NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 113 -...
  • Page 115 Sign & Name Sheet/ Sheets MODEL L1150 03/18 R224 YW YOON C230 C231 Designer 2004 03/18 Checked DS JUNG 2004 DRAWING AUDIO NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 114 -...
  • Page 116 Section Date Sign & Name Sheet/ L1150 Sheets MODEL 03/18 Designer YH HEO 2004 03/18 Checked DS JUNG 2004 DRAWING MEMORY NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 115 -...
  • Page 117 Sign & Name Sheet/ L1150 Sheets R423 MODEL VA402 03/18 AVL5M02-200 YH HEO Designer 2004 DS JUNG 03/18 Checked 2004 DRAWING NAME Approved DRAWING V1.2 Iss. Notice No. Date Name LG Electronics Inc. LGIC(42)-A-5505-10:01 LG Electronics Inc. - 116 -...
  • Page 118 Section Date Sign & Name Sheet/ Sheets MODEL L1150 03/18 YH HEO Designer 2004 03/18 Checked DS JUNG 2004 DRAWING Peripheral NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 117 -...
  • Page 119 Section Date Sign & Name Sheet/ L1150 Sheets MODEL 03/18 HC KWAK Designer 2004 03/18 Checked DS JUNG 2004 DRAWING CAMERA NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 118 -...
  • Page 120 MODEL L1150 03/18 LCD_BACKLIGHT EN_SET HC KWAK Designer 2004 MLED VA707 AVL5M02-200 SLED 03/18 Checked DS JUNG 2004 C746 C747 DRAWING NAME Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 119 -...
  • Page 121 2004 _ERR R834 C846 C847 C848 4.7K 0.47u 2.2u 03/18 (1608) (1608) Checked YM CHO 2004 DRAWING C849 RF_AERO I NAME 470p Approved DRAWING Iss. Notice No. Date Name LG Electronics Inc. V1.2 LGIC(42)-A-5505-10:01 LG Electronics Inc. - 120 -...

  • Page 122: Pcb Layout

    9. PCB LAYOUT - 121 -...
  • Page 123 9. PCB LAYOUT - 122 -...

  • Page 124: Stand Alone Test & Calibration

    10. STAND ALONE TEST & CALIBRATION 10. STAND ALONE TEST & CALIBRATION A. What is Standalone Test? • What’s the Standalone Test? • Set the Phone to Perform only Tx or Rx mode • During the Normal Call • During Rx Standalone •...

  • Page 125: Rx Standalone Test

    10. STAND ALONE TEST & CALIBRATION C. Rx Standalone Test 1. Test Equipment Setting Set Test equip. to “CW Generator” Set RF Frequency • RX Frequency + 67.7 kHz • Ex.) GSM 190Ch : 881.6MHz + 67.7KHz = 881.6677MHz Set RF Power –60dBm D.

  • Page 126: What Is Calibration

    10. STAND ALONE TEST & CALIBRATION E. What is Calibration? 1. What’s the Rx Calibration Find proper AGC Gain to make the same Rx Power fed into the Base Band Part regardless of Antenna Input Level Can make report correct RSSI level Part X(Input Level)+G(Gain)=Y 2.

  • Page 127: Calibration Program

    10. STAND ALONE TEST & CALIBRATION F. Calibration program 1. Calibration program(ChiWoo) • Under windows 98 or 2k • Not support win xp 2. Required Equipments • Test PC with PCMCIA slot • GPIB card and cable(IEEE 488 2ea) • PIF JIG •...

  • Page 128: Calibration Equipment Setup

    10. STAND ALONE TEST & CALIBRATION G. Calibration Equipment Setup GSM Test Set(8960) GPIB control Power Supply (Agilent 66311B) L1150 Battery SIMulator - 127 -...

  • Page 129: Calibrate L1150 With Chiwoo

    10. STAND ALONE TEST & CALIBRATION H. Calibrate L1150 with ChiWoo 1. Start ChiWoo.exe file. • After connect phone and equipments, click CAL button • You can see the right image. 2. Click calibration start button. - 128 -...

  • Page 130: Setup And Test With Laputa

    10. STAND ALONE TEST & CALIBRATION 3. Click EXIT button after appearing PASS. • Calibration Results are saved automatically. I. Setup and Test with LAPUTA 1. Initialize Target • After connect phone and equipments, click Initialize button • You can see the green signal after successful initialize - 129 -...
  • Page 131 10. STAND ALONE TEST & CALIBRATION 2. AUTO CAL • Click AUTO CAL tab. • Another auto cal window will appeared 3. Rx • Click Rx tab. • Select the band. (Dualus : GSM850, PCS1900 Dualext : DCS1800) • Click Set button •...
  • Page 132 10. STAND ALONE TEST & CALIBRATION 4. Tx • Click Tx tab. • Select the band. (Dualus : GSM850, PCS1900 Dualext : DCS1800) • Click Set button • Input the appropriate Power Index. And click Set button. • Input the appropriate DAC value. And click Set button. •...

  • Page 134: Exploded View & Replacement Part List

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.1 EXPLODED VIEW - 133 -...

  • Page 136: Replacement Parts

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Mechanic component> - 135 -...
  • Page 137 11. EXPLODED VIEW & REPLACEMENT PART LIST - 136 -...
  • Page 138 11. EXPLODED VIEW & REPLACEMENT PART LIST - 137 -...

  • Page 139: Main Component

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.2 Replacement Parts Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC <Main component> - 138 -...
  • Page 140 11. EXPLODED VIEW & REPLACEMENT PART LIST - 139 -...
  • Page 141 11. EXPLODED VIEW & REPLACEMENT PART LIST - 140 -...
  • Page 142 11. EXPLODED VIEW & REPLACEMENT PART LIST - 141 -...
  • Page 143 11. EXPLODED VIEW & REPLACEMENT PART LIST - 142 -...
  • Page 144 11. EXPLODED VIEW & REPLACEMENT PART LIST - 143 -...
  • Page 145 11. EXPLODED VIEW & REPLACEMENT PART LIST - 144 -...
  • Page 146 11. EXPLODED VIEW & REPLACEMENT PART LIST - 145 -...
  • Page 147 11. EXPLODED VIEW & REPLACEMENT PART LIST - 146 -...
  • Page 148 11. EXPLODED VIEW & REPLACEMENT PART LIST - 147 -...
  • Page 149 11. EXPLODED VIEW & REPLACEMENT PART LIST - 148 -...
  • Page 150 11. EXPLODED VIEW & REPLACEMENT PART LIST - 149 -...

  • Page 151: Accessory

    11. EXPLODED VIEW & REPLACEMENT PART LIST 11.3 Accessory Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC - 150 -...

Table of Contents